臺(tái)慶 | 科車(chē)用等級(jí)高耐流低直流阻抗芯片磁珠

HFZ-SERIES

芯片磁珠在EMI應(yīng)用市場(chǎng)上一直扮演的重要角色，不論任何的電子產(chǎn)品，總是需要芯片磁珠的挹注，方能做到完善的電磁兼容，在避免訊號(hào)失真的同時(shí)，更減少影響到生活周邊的各項(xiàng)電子設(shè)施。

Chip beads have always played an important role in the EMI suppression application. Regardless of any electronic products, the use of chip beads are always required to achieve perfect electromagnetic compatibility. While avoiding signal distortion, it also reduces the EMI noise that may impact on surrounding electronic products.

芯片磁珠主要材料組成包含了鐵氧體、銀、鎳、錫等，而磁珠生產(chǎn)透過(guò)使用不同的鐵氧體材料使得在不同的頻率應(yīng)用下，有效解決EMI各項(xiàng)問(wèn)題。

The main material composition of ferrite chip beads includes ferrite, silver, nickel, tin, etc., and the production of chip beads use different ferrite materials to effectively solve various EMI problems under different frequency applications.

隨著科技的日新月異，電子市場(chǎng)上充斥各類(lèi)不同型態(tài)的產(chǎn)品，各個(gè)生產(chǎn)廠商無(wú)所不用其極的希望自家產(chǎn)品都能夠做到產(chǎn)品的獨(dú)創(chuàng)性、與他人的差異性、當(dāng)然更重要的還是需要做到產(chǎn)品的微型化。

With the rapid development of technology, the electronic market is flooded with various types of products. Each manufacturer hopes that their products can achieve uniqueness and differentiation from others, and of course, the miniaturization of the products is also important.

臺(tái)慶科所推出的新型芯片磁珠產(chǎn)品HFZ-SERIES，透過(guò)臺(tái)慶科自行設(shè)計(jì)的自動(dòng)化生產(chǎn)機(jī)具，加上特制鐵氧體及其他材料搭配，找正品元器件，上唯樣商城，成功優(yōu)化產(chǎn)品性能，并且產(chǎn)品經(jīng)過(guò)車(chē)用等級(jí)AEC-Q200的嚴(yán)格檢測(cè)要求，更是有效利用于汽車(chē)電子市場(chǎng)。

TAI-TECH’s Technology has introduced a new type of chip bead product, the HFZ-SERIES, which optimizes product performance through its self-designed automated production equipment, special ferrite and other materials. The product has also passed strict reliability testing requirements, such as the automotive-grade AEC-Q200 standard, making it effective to apply in the automotive electronics application.

HFZ具備著低直流阻抗的產(chǎn)品特性，使得產(chǎn)品應(yīng)用溫度更加具有彈性，小型化大電流的產(chǎn)品設(shè)計(jì)也為工程師LAYOUT設(shè)計(jì)增加更多利用率，也減少材料成本。

HFZ Series features low DCR, and it effectively performs compact size and high current performance with wide operating temperature range, which is flexible and high utilization for engineer’s PCB layout design, and cost saving.

The use of HFZ-series can reduce both the size and the cost, which avoid the impact of material price fluctuations.

HFZ is smaller in size, and also provides a better temperature rise performance.

產(chǎn)品特點(diǎn)

1、適用于 -55°C ~ 125°C度操作溫度范圍

Operating temperature -55°C ~ 125°C

2、符合 RoHS、 REACH 、Lead Free等環(huán)境要求

100% Lead (Pb) & Halogen-Free and REACH & RoHS compliant.

3、產(chǎn)品低直流阻抗、低損耗

Low DCR & Low loss

4、適用于波鋒焊制程應(yīng)用

Suitable for wave soldering process applications

5、符合車(chē)用等級(jí) AEC-Q200測(cè)試要求

Reliability test complied with AEC-Q200.

主要產(chǎn)品規(guī)格特性

審核編輯 黃宇